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S-Cubed
supports the industry with engineering know-how for equipment and
process design. Working directly with semiconductor manufacturers and
OEM's, S-Cubed have designed equipment for specific process
requirements that otherwise could not be met.
Flexi-PCS WEE Automated Wafer Edge Exposure (up to 12") for Lab and Production.
FotoFab™ Semi Automated Spin Coat/Bake/Chill Processor for Lab Lithography (up to 12").
Flexi-PCS™
Spin coat, Bake and Develop processors, for Lithography Production.
TruClean™ systems
using double-sided scrubbing (patented) and
megasonic technology.
Cyclone™ small
footprint chemical processing systems, for
manual / automatic cleaning or etching applications such as the High
Pressure IPA Frame-Mounted Wafer Clean configuration.
Controlled environment (vacuum,
oxygen free, etc.) hot plates and
systems for up to 450ºC for both photolithographic and other
processes requiring programmable and precise substrate heating.
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